Pickup SMD transistors. SMD marking. Guide for practitioners. The convenience of such a transistor is not only in its size, but also the fact that in most cases the ceiling of such elements is the same

Hi friends and readers of the site "Radiosham", we continue to get acquainted with you with modern. Today's review is an overview of SMD transistors that you probably have already seen in modern various electronic devices.

Transistors in SMD package, very convenient, especially where every millimeter is important. Imagine how the mobile phone has changed (the board of which is completely from SMD details), if there were usual output DIP parts.

Above the photo SMD transistor on the background of the usual, in to 92.

This is a photo of various SMD transistors, on the right - the usual in TO92. As a rule, the base of all such transistors is the same - this is also a huge plus.

Name of various enclosures, DIP and SMD. Photos can be enlarged.

How the planar transistors are made, you can see below.

The planar, as well as in ordinary transistors, has many species, composite (Darlington), field, bipolar and IGBT (bipolar transistors with an insulated shutter).

Pay attention, on the boards and transistors circuits are marked with "q" and "vt" (it should be so, although some manufacturers are forced by this), why am I writing it? Often in the same case, the manufacturer can shove everything that he wants - from a diode to a linear voltage stabilizer (78xx), even different sensors. There is still an internal marker of the plant, for example, the details of the company EPCOS. It is very difficult for such details to find datashet, and sometimes it is not at all on the Internet.

Soldering

Solding such transistors is not difficult, especially accelerates and makes lighter, the process of soldering various SMD details - microscope, tweezers (simply indispensable things) various fluxes and soldering fats with BGA paste. First, Ludim contact pads of our transistor and fees (do not overheat).

Then we position our transistor, I make it tweezers.

Shipping any of the legs. We leave tweezers, and position our detail as younger, for a great view, so to speak :)

We solder the remaining "legs" of the radio element.

And here our transistor is tight and well soldered to the board. In the following articles, I will write about this with everything more details (fluxes, tweezers, soldering, etc.). And about the symbols and bonds of different types of transistors - there are several very useful links on the forum. The article wrote Bios..

Discuss an article SMD transistors

Today we will talk about SMD components that appeared thanks to the progress in the field of electronics and a little touched on such a radio element as .
Surface Mounted Device or SMD. It is translated like this - surface mounting devices, i.e. The type of radio components that are soldered from the side of the tracks and contact sites immediately on the fee.

In modern electronics it is difficult to find a scheme in which it would not be used sMD components . By parameters, most SMD parts do not differ from the usual, except size and weight. Thanks to its compactness, it became possible to create complex electronic devices of small sizes, well, for example a cell phone.

The convenience of such a transistor lies not only in its size, but also the fact that in most cases the bonding of such elements is the same.

Below is the design of these planar transistors.

As with ordinary, planar transistors also have many species: field, composite (Darlington), IGBT (bipolar, with an isolated shutter), bipolar.
  1. Introduction
  2. SMD components
  3. SMD sizes components
    • SMD resistors
    • SMD condensers
    • SMD coils and chokes
  4. SMD transistors
  5. Marking SMD components
  6. Soldering SMD components

Introduction

Not only ordinary components with conclusions are now available to the modern radio amateur, but also so small, dark ones, on which it is not understood that the details are written. They are called "SMD". In Russian, this means "surface mounting components. Their main advantage is that they allow the industry to collect fees with robots, which, with a huge speed, arrange the SMD components in their places on printed circuit boards, and then massively "baked" and the output is obtained by mounted printed circuit boards. The fraction of a person remains those operations that the robot cannot fulfill. Can not yet.

The use of chip-components in amateur practice is also possible, it is even necessary, as it allows to reduce the weight, size and cost of the finished product. Yes, it is also practically not necessary to drill.

For those who first encountered SMD components natural is confusion. How to figure out their variety: where the resistor, and where is the condenser or transistor, what are they sizes, which SMD-parts are existing? You will find answers below for all these questions. Read, come in handy!

Chip Component Cases

It is sufficiently conditionally all components of the surface installation can be divided into groups by the number of conclusions and the size of the housing:

conclusions / Size Very little Very small Little Middle
2 output SOD962 (DSN0603-2), WLCSP2 *, SOD882 (DFN1106-2), SOD882D (DFN1106D-2), SOD523, SOD1608 (DFN1608D-2) SOD323, SOD328. SOD123F, SOD123W SOD128.
3 output Sot883b (DFN1006B-3), sot883, sot663, sot416 Sot323, sot1061 (DFN2020-3) SOT23. SOT89, DPAK (TO-252), D2PAK (TO-263), D3PAK (TO-268)
4-5 conclusions Wlcsp4 *, sot1194, wlcsp5 *, sot665 SOT353. SOT143B, SOT753. SOT223, POWER-SO8
6-8 conclusions Sot1202, sot891, sot886, sot666, wlcsp6 * SOT363, SOT1220 (DFN2020MD-6), SOT1118 (DFN2020-6) Sot457, sot505 Sot873-1 (DFN3333-8), sot96
\u003e 8 conclusions WLCSP9 *, SOT1157 (DFN17-12-8), Sot983 (DFN1714U-8) WLCSP16 *, SOT1178 (DFN2110-9), WLCSP24 * Sot1176 (DFN2510A-10), Sot1158 (DFN2512-12), Sot1156 (DFN2521-12) Sot552, sot617 (DFN5050-32), sot510

Of course, the housing in the table is not indicated not all, since the real industry produces components in new buildings faster than standardization bodies are kept behind them.

The SMD component housings can be both with conclusions and without them. If there are no conclusions, then there are contact sites on the case or small solder balls (BGA). Also, depending on the manufacturer's company, parts may differ in labeling and dimensions. For example, capacitors may vary.

Most SMD component enclosures are designed for installation with special equipment that radio amateurs do not have and are unlikely to ever have. This is connected with the technology of soldering such components. Of course, with certain perseverance and fanaticism, it is possible at home to solder.

SMD Housing Types by name

Name Decoding callery
Sot. small Outline Transistor 3
Sod. small Outline Diode. 2
SOIC small Outline Integrated Circuit \u003e 4, in two lines on the sides
Tsop. thin Outline Package (Slim SOIC) \u003e 4, in two lines on the sides
SSOP. sewage SOIC \u003e 4, in two lines on the sides
TSSOP. thin seated SOIC \u003e 4, in two lines on the sides
QSOP. SOIC fourth size \u003e 4, in two lines on the sides
Vsop. QSOP even smaller \u003e 4, in two lines on the sides
PLCC IP in a plastic case with conclusions hound under the case with the form of the letter J. \u003e 4, four lines on the sides
CLCC IP in the ceramic case with conclusions hound under the case with the form of the letter J. \u003e 4, four lines on the sides
QFP. square flat housing \u003e 4, four lines on the sides
LQFP. low profile QFP \u003e 4, four lines on the sides
Pqfp. plastic QFP. \u003e 4, four lines on the sides
CQFP. ceramic QFP. \u003e 4, four lines on the sides
TQFP. thinned QFP \u003e 4, four lines on the sides
PQFN. silence QFP without conclusions with a platform for radiator \u003e 4, four lines on the sides
BGA. Ball Grid Array. Array of balls instead of conclusions array of conclusions
LFBGA low profile FBGA array of conclusions
CGA. case with input and output outputs from refractory solder array of conclusions
CCGA CGA in a ceramic building array of conclusions
μBGA. Micro BGA. array of conclusions
FCBGA. Flip-Chip Ball Grid Array. M.the assistance of balls on the substrate to which the crystal is soldered with the heat sink array of conclusions
LLP. software building

From all this zoo of chip components for amateur uses can be consolidated: chip resistors, chip capacitors, chip inductance, chip diodes and transistors, LEDs, stabilods, some chips in SOIC housings. Capacitors usually look like simple parallelpipeda or small barrels. Barrels are electrolytic, and the parallelpipeda will most likely be tantalum or ceramic capacitors.


SMD-component sizes

The chip components of one nominal may have different dimensions. The dimensions of the SMD component are determined by its "satellite". For example, chip resistors have sizes from "0201" to "2512". With these four digits, the width and length of the chip resistor in inches are encoded. Below in the tables you can see the sizes in millimeters.

sMD resistors

Rectangular chip resistors and ceramic capacitors
Size L, mm (inch) W, mm (inches) H, mm (inch) A, mm. T.
0201 0.6 (0.02) 0.3 (0.01) 0.23 (0.01) 0.13 1/20
0402 1.0 (0.04) 0.5 (0.01) 0.35 (0.014) 0.25 1/16
0603 1.6 (0.06) 0.8 (0.03) 0.45 (0.018) 0.3 1/10
0805 2.0 (0.08) 1.2 (0.05) 0.4 (0.018) 0.4 1/8
1206 3.2 (0.12) 1.6 (0.06) 0.5 (0.022) 0.5 1/4
1210 5.0 (0.12) 2.5 (0.10) 0.55 (0.022) 0.5 1/2
1218 5.0 (0.12) 2.5 (0.18) 0.55 (0.022) 0.5 1
2010 5.0 (0.20) 2.5 (0.10) 0.55 (0.024) 0.5 3/4
2512 6.35 (0.25) 3.2 (0.12) 0.55 (0.024) 0.5 1
Cylindrical chip resistors and diodes
Size Ø, mm (inches) L, mm (inch) T.
0102 1.1 (0.01) 2.2 (0.02) 1/4
0204 1.4 (0.02) 3.6 (0.04) 1/2
0207 2.2 (0.02) 5.8 (0.07) 1

sMD condensers

Ceramic chip capacitors coincide according to the sizer with chip resistors, but tantalum chip capacitors have their own system of sizes:

Tantalum capacitors
Size L, mm (inch) W, mm (inches) T, mm (inch) B, mm. A, mm.
A. 3.2 (0.126) 1.6 (0.063) 1.6 (0.063) 1.2 0.8
B. 3.5 (0.138) 2.8 (0.110) 1.9 (0.075) 2.2 0.8
C. 6.0 (0.236) 3.2 (0.126) 2.5 (0.098) 2.2 1.3
D. 7.3 (0.287) 4.3 (0.170) 2.8 (0.110) 2.4 1.3
E. 7.3 (0.287) 4.3 (0.170) 4.0 (0.158) 2.4 1.2

sMD inductance coils and chokes

Inductance is found in the set of types of buildings, but the housing is obeyed by the same law of sizes. It fits automatic installation. And we, radio amateurs, makes it easier to navigate.

Any coils, chokes and transformers are called "Moting Products". We usually wash them themselves, but sometimes you can buy ready-made products. Especially if SMD options are required that are manufactured with a set of bonuses: magnetic body shielding, compactness, closed or open body, high quality, electromagnetic shielding, wide operating temperature range.

Chosen the demanding coil is better in directories and the required standard. Samplers, as well as for chip resistors, are set by the set of code of four numbers (0805). In this case, "08" denotes the length, and "05" width in inches. The actual size of such a SMD component will be 0.08x0.05 inches.

sMD Diodes and Stabilians

Diodes can be both in cylindrical buildings and in the housings in the form of small parallelpiped. Cylindrical diodes housings are most often pre-served by Minimelf (SOD80 / DO213AA / LL34) or MELF (DO213AB / LL41). Suitoruses are asked as coils, resistors, capacitors.

Diodes, Stabilians, Capacitors, Resistors
Type of shell L * (mm) D * (mm) F * (mm) S * (mm) Note
DO-213AA (SOD80) 3.5 1.65 048 0.03 Jedec.
DO-213AB (MELF) 5.0 2.52 0.48 0.03 Jedec.
DO-213AC. 3.45 1.4 0.42 - Jedec.
ERD03LL 1.6 1.0 0.2 0.05 Panasonic
ER021L 2.0 1.25 0.3 0.07 Panasonic
ERSM 5.9 2.2 0.6 0.15 Panasonic, GOST P1-11
Melf. 5.0 2.5 0.5 0.1 Cents
SOD80 (Minimelf) 3.5 1.6 0.3 0.075 Philips.
SOD80C. 3.6 1.52 0.3 0.075 Philips.
SOD87. 3.5 2.05 0.3 0.075 Philips.

sMD transistors

Surface installation transistors can also be small, medium and high power. They also have the corresponding hulls. Transistor enclosures can be divided into two groups: SOT, DPAK.

I want to pay attention to that there may also be assemblies from several components in such buildings, and not just transistors. For example, diode assemblies.

Marking SMD components

It sometimes seems to me that the marking of modern electronic components has become a whole science, such history or archeology, as to understand which component is installed on the fee sometimes have to have a whole analysis of the surrounding elements. In this regard, the Soviet output components, on which the text was written the nominal and the model were just a dream for an amateur, since it was not necessary to steer piles of reference books to figure out what it was for the details.

The reason lies in the automation of the assembly process. SMD components are set by robots in which selected boobins are installed (similar to non-labbins with magnetic ribbons), in which the chip components are located. The robot is still what is there in Babin and whether the parts are labeled. Marking is needed by a person.

Chip-component

At home, the chip component can only be soldered to certain sizes, more or less comfortable for manual installation is considered to be the size of 0805. The miniature components are soldered by the stove. At the same time, for high-quality propagation at home, a whole range of measures should be observed.